CPM (Composite Solder Pallet Material) is the ideal material for electronics assembly fixtures as they are suited for all assembly, reflow and wave solder processes. It have been developed for all procedures within the PCB assembly process. CPM pallets are compatible with both lead free solder and halide flux systems and can be used as carriers in wave solder and SMT processing applications. These applications include lead-free soldering, conformal coating and composite tooling, and provide fabricators with quality control improvement, reduced downtime and operation cost.
Available grades:
CPM-C
CPM-H
Stock Shape / Size Range : Plate (Thickness: 2mm – 30mm)
Wave solder pallets, printed circuit boards, solder past carriers, SMT replacement, IR-Reflow, conformal coating applications
Characteristics:
Excellent mechanical properties at elevated temperatures
Low thermal conductivity
Excellent machining properties enabling the manufaturer of complex design solder pallets
Good resistance to chemicals in modern fluxes.
Surface resistivity
Excellent dimensional stability